Invention Application
- Patent Title: SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US16430625Application Date: 2019-06-04
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Publication No.: US20200161277A1Publication Date: 2020-05-21
- Inventor: Hak-Seung LEE , Kwang-Jin Moon , Tae-Seong Kim , Dae-Suk Lee , Dong-Chan Lim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1bb95eed
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/48 ; H01L23/522 ; H01L23/528 ; H01L23/31 ; H01L23/00 ; H01L25/00

Abstract:
A semiconductor package includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a substrate having a first via hole, an insulation interlayer formed on the substrate and having a first bonding pad in an outer surface thereof and a second via hole connected to the first via hole and exposing the first bonding pad, and a plug structure formed within the first and second via holes to be connected to the first bonding pad. The second semiconductor chip includes a second bonding pad bonded to the plug structure which is exposed from a surface of the substrate of the first semiconductor chip.
Public/Granted literature
- US10950578B2 Semiconductor device, semiconductor package and method of manufacturing the same Public/Granted day:2021-03-16
Information query
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