A method of manufacturing a light-emitting device includes: providing an intermediate structure including: layered bodies in a light-reflective member, a semiconductor layered body, and a light-transmissive member; forming at least one first groove at a first surface of the intermediate structure; forming at least one electrically conductive film, each disposed on the first surface and inside a respective one of the at least one first groove; exposing a portion of the light-reflective member in an inter-electrode region; forming a hole having a width equal to or greater than a width of the at least one first groove and having a depth equal to or greater than a depth of the at least one first groove; and cutting the light-reflective member and the at least one electrically conductive film along the at least one first groove to obtain a plurality of light-emitting devices.