Invention Application
- Patent Title: NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS
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Application No.: US16774529Application Date: 2020-01-28
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Publication No.: US20200165124A1Publication Date: 2020-05-28
- Inventor: Nazila Dadvand , Kathryn Schuck
- Applicant: Texas Instruments Incorporated
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00 ; H01L23/00
Abstract:
A semiconductor package including a semiconductor die and at least one bondline positioned on the semiconductor die, the at least one bondline comprising a nickel lanthanide alloy diffusion barrier layer abutting a gold layer.
Public/Granted literature
- US11091366B2 Nickel lanthanide alloys for MEMS packaging applications Public/Granted day:2021-08-17
Information query
