Invention Application
- Patent Title: COIL COMPONENT
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Application No.: US16566298Application Date: 2019-09-10
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Publication No.: US20200168375A1Publication Date: 2020-05-28
- Inventor: Il Jin PARK , Gwang Hwan HWANG , Jun Sung LEE , Soon Kwang KWON
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@b06f335
- Main IPC: H01F1/147
- IPC: H01F1/147 ; H01F27/28 ; H01F27/29 ; H01F27/255

Abstract:
A coil component includes a body having one surface and the other surface facing each other, and a plurality of wall surfaces connecting the one surface and the other surface, and having a distance from the one surface to the other surface of 0.65 mm or less (excluding 0 mm); and a coil portion embedded in the body, wherein the body comprises an Fe—Si—B—Nb—Cu-based metal magnetic powder particle represented by the following chemical formula 1, wherein the Fe—Si—B—Nb—Cu-based metal magnetic powder particle comprises a crystal grain of 20 nm or less (excluding 0 mm), FeaSibBcNbdCue [Chemical Formula 1] (where 73 atom %≤a≤77 atom %, 10 atom %≤b≤14 atom %, 9 atom%≤c≤11 atom %, 2 atom %≤d≤3 atom %, 0.5 atom %≤e≤1 atom %, and a+b+c+d+e=100).
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