公开(公告)号：US20180061550A1

公开(公告)日：2018-03-01

申请号：US15471727

申请日：2017-03-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Hyung LEE ,  Je Ik MOON ,  Jung Wook SEO ,  Jun Sung LEE ,  Woo Jin LEE ,  Kang Ryong CHOI ,  Il Jin PARK ,  Gwang Hwan HWANG

IPC: H01F27/255 ,  H01F27/28 ,  H01F27/29

CPC classification number: H01F27/255 ,  H01F1/26 ,  H01F1/33 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/048

Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 μm to 28 μm; the second magnetic metal particles have an average particle size of 1 μm to 4.5 μm; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.

公开(公告)号：US20200066437A1

公开(公告)日：2020-02-27

申请号：US16668504

申请日：2019-10-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Se Hyung LEE ,  Je Ik MOON ,  Jung Wook SEO ,  Jun Sung LEE ,  Woo Jin LEE ,  Kang Ryong CHOI ,  Il Jin PARK ,  Gwang Hwan HWANG

IPC: H01F27/255 ,  H01F1/26 ,  H01F1/33 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01F27/28

Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 μm to 28 μm; the second magnetic metal particles have an average particle size of 1 μm to 4.5 μm; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.

公开(公告)号：US20220189676A1

公开(公告)日：2022-06-16

申请号：US17241351

申请日：2021-04-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Joong Won PARK ,  Il Jin PARK ,  Se Hyung LEE ,  Jun Sung LEE ,  Seok Hee LEE ,  Ji Hwan SHIN

IPC: H01F27/255 ,  H01F27/29 ,  H01F17/00

Abstract: A coil electronic component includes a body including a coil portion therein, and including a plurality of magnetic particles including an Fe-based alloy component, and an external electrode connected to the coil portion, wherein at least a portion of the plurality of magnetic particles include a first layer formed on a surface, and a second layer formed on a surface of the first layer, wherein the first layer includes an Fe oxide component and has a thickness of 10 nm or less.

公开(公告)号：US20210217546A1

公开(公告)日：2021-07-15

申请号：US16879027

申请日：2020-05-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Il Jin PARK ,  Jun Sung LEE ,  Joong Won PARK ,  Gwang Hwan HWANG ,  Soon Kwang KWON

IPC: H01F1/33 ,  H01F1/147

Abstract: A magnetic powder contains a magnetic metal particle comprising iron (Fe) and an insulating coating layer disposed on a surface of the magnetic metal particle and comprising tin (Sn), phosphorous (P) and oxygen (O), and a coil component contains such a magnetic powder.

公开(公告)号：US20200168375A1

公开(公告)日：2020-05-28

申请号：US16566298

申请日：2019-09-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Il Jin PARK ,  Gwang Hwan HWANG ,  Jun Sung LEE ,  Soon Kwang KWON

IPC: H01F1/147 ,  H01F27/28 ,  H01F27/29 ,  H01F27/255

Abstract: A coil component includes a body having one surface and the other surface facing each other, and a plurality of wall surfaces connecting the one surface and the other surface, and having a distance from the one surface to the other surface of 0.65 mm or less (excluding 0 mm); and a coil portion embedded in the body, wherein the body comprises an Fe—Si—B—Nb—Cu-based metal magnetic powder particle represented by the following chemical formula 1, wherein the Fe—Si—B—Nb—Cu-based metal magnetic powder particle comprises a crystal grain of 20 nm or less (excluding 0 mm), FeaSibBcNbdCue  [Chemical Formula 1] (where 73 atom %≤a≤77 atom %, 10 atom %≤b≤14 atom %, 9 atom%≤c≤11 atom %, 2 atom %≤d≤3 atom %, 0.5 atom %≤e≤1 atom %, and a+b+c+d+e=100).