A flexible electronic interconnect comprises a first dielectric layer including a first surface and second surface opposite the first surface; a plurality of conductors disposed on the first surface of the first dielectric layer and arranged spaced apart from each other using a conductor spacing; and a first plurality of conductive shields disposed on the second surface of the first dielectric layer and arranged spaced apart from each other using a conductive shield spacing. The first plurality of conductive shields is arranged opposite the plurality of conductors and the conductive shield spacing is arranged opposite the conductor spacing.