- 专利标题: SMALL-DIAMETER INSULATED WIRE
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申请号: US16633876申请日: 2018-04-27
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公开(公告)号: US20200176148A1公开(公告)日: 2020-06-04
- 发明人: Kenji HORI
- 申请人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka-shi, Osaka
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@14bc1f6
- 国际申请: PCT/JP2018/017269 WO 20180427
- 主分类号: H01B7/04
- IPC分类号: H01B7/04 ; H01B7/02 ; H01B3/44
摘要:
A small-diameter insulated wire has a small diameter and high bending resistance. In a small-diameter insulated wire having a conductor and an insulating layer covering the conductor, a cross-sectional area of the conductor is 0.08 mm2 or more and 0.4 mm2 or less, the conductor is a copper alloy having a breaking strength of 815 MPa or more, a breaking strength of the insulating layer is 36.5 MPa or more, a thickness of the insulating layer is 0.1 mm or more and 0.2 mm or less, and a conductor pullout force for drawing the conductor from the small-diameter insulated wire is 9 N/30 mm or less.
公开/授权文献
- US10734135B2 Small-diameter insulated wire 公开/授权日:2020-08-04
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