A modular electronics package is disclosed that includes a first and second electronics packages, with each of the first and second electronics packages including a metallized insulating substrate and a solid-state switching device positioned on the metallized insulating substrate, the solid-state switching device comprising a plurality of contact pads electrically coupled to the first conductor layer of the metallized insulating substrate. A conductive joining material is positioned between the first electronics package and the second electronics package to electrically connect them together. The first electronics package and the second electronics package are stacked with one another to form a half-bridge unit cell, with the half-bridge unit cell having a current path through the solid-state switching device in the first electronics package and a close coupled return current path through the solid-state switching device in the second electronics package in opposite flow directions.