An enclosure assembly for enclosing an electronic controller. The enclosure assembly comprises a housing having a plurality of cavities formed therein for receiving electrical components of the electrical controller. The enclosure assembly further includes an over-molded part formed from an elastic material that lines at least a portion of each cavity. The over-molded part reduces the effect of deceleration forces on the electrical component that is received in the cavity thereby protecting it from damage. The over-molded part includes a retention feature that locates the over-molded part within the cavity and secures it to the enclosure assembly. An interference fit is provided between the over-molded part and the electrical component received in the cavity.