Invention Application
- Patent Title: PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE
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Application No.: US16793550Application Date: 2020-02-18
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Publication No.: US20200183105A1Publication Date: 2020-06-11
- Inventor: Radhakrishnan L. NAGARAJAN , Peng-Chih LI , Masaki KATO
- Applicant: INPHI CORPORATION
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H04B10/516 ; H04B10/40

Abstract:
A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
Public/Granted literature
- US10908370B2 Package structure for photonic transceiving device Public/Granted day:2021-02-02
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