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    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE
    1.
    发明申请
    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE 审中-公开

    公开(公告)号：US20200018912A1

    公开(公告)日：2020-01-16

    申请号：US16579671

    申请日：2019-09-23

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Masaki KATO

    IPC: G02B6/42 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    PHOTONIC TRANSCEIVING DEVICE PACKAGE STRUCTURE
    2.
    发明申请
    PHOTONIC TRANSCEIVING DEVICE PACKAGE STRUCTURE 有权
    光电收发器件封装结构

    公开(公告)号：US20170031117A1

    公开(公告)日：2017-02-02

    申请号：US15289894

    申请日：2016-10-10

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Masaki KATO

    IPC: G02B6/42 ,  G02B6/30 ,  G02F1/225 ,  H04B10/40

    CPC classification number: G02B6/4257 ,  G02B6/30 ,  G02B6/421 ,  G02B6/4243 ,  G02B6/4246 ,  G02B6/4251 ,  G02B6/4271 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4286 ,  G02B6/4292 ,  G02F1/2255 ,  G02F2001/212 ,  H04B10/40 ,  H04B10/516 ,  H04J14/02

    Abstract: The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices in transmit-optical-sub-assembly package, each being mounted upside-down on the PCB and including a built-in TEC module in contact with the lid member and a laser output port aiming toward the back end. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.

    Abstract translation: 该装置包括具有底座构件，两个部分侧构件和盖构件的壳体，以在基座构件的后端提供具有开口的空间体积。 此外，该设备包括安装在基座部件上方的空间体积内的PCB，后端具有可插拔连接器。 该装置包括一个或多个透射 - 光学 - 组件封装中的光学传输装置，它们分别安装在PCB上，并且包括与盖构件接触的内置TEC模块和朝向 后端 此外，该装置包括硅光子芯片，其包括安装在PCB上的光纤至硅附着模块，并耦合到调制驱动器模块和跨阻抗放大器模块。 此外，该装置包括光输入端口和输出端口，其被连接到光纤到硅附接模块。

    SMALL FORM FACTOR TRANSMITTING DEVICE
    3.
    发明申请
    SMALL FORM FACTOR TRANSMITTING DEVICE 有权

    公开(公告)号：US20210091536A1

    公开(公告)日：2021-03-25

    申请号：US17115296

    申请日：2020-12-08

    Applicant: Inphi Corporation ,  Luxnet Corporation

    Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Pi-Cheng LAW

    IPC: H01S5/06 ,  H04B10/50 ,  H01S5/024 ,  H01S5/00 ,  H01S5/022 ,  G02B6/42 ,  H01S5/068 ,  H01S5/125

    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    SMALL FORM FACTOR TRANSMITTING DEVICE
    4.
    发明申请
    SMALL FORM FACTOR TRANSMITTING DEVICE 审中-公开

    公开(公告)号：US20200076158A1

    公开(公告)日：2020-03-05

    申请号：US16679014

    申请日：2019-11-08

    Applicant: INPHI CORPORATION ,  Luxnet Corporation

    Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Pi-Cheng LAW

    IPC: H01S5/06 ,  H01S5/125 ,  H01S5/068 ,  H01S5/022 ,  G02B6/42 ,  H01S5/00 ,  H01S5/024 ,  H04B10/50

    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE
    6.
    发明申请
    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE 审中-公开

    公开(公告)号：US20180299629A1

    公开(公告)日：2018-10-18

    申请号：US16013737

    申请日：2018-06-20

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Masaki KATO

    IPC: G02B6/42 ,  H04B10/516 ,  H04B10/40

    CPC classification number: G02B6/4246 ,  G02B6/421 ,  G02B6/4215 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4292 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE
    7.
    发明申请
    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE 审中-公开

    公开(公告)号：US20200183105A1

    公开(公告)日：2020-06-11

    申请号：US16793550

    申请日：2020-02-18

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Masaki KATO

    IPC: G02B6/42 ,  H04B10/516 ,  H04B10/40

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE
    10.
    发明申请
    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE 有权

    公开(公告)号：US20170090132A1

    公开(公告)日：2017-03-30

    申请号：US15375042

    申请日：2016-12-09

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Masaki KATO

    IPC: G02B6/42 ,  H04B10/40

    CPC classification number: G02B6/4246 ,  G02B6/421 ,  G02B6/4215 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4292 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

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