Invention Application
- Patent Title: Leadframe With Vertically Spaced Die Attach Pads
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Application No.: US16788695Application Date: 2020-02-12
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Publication No.: US20200185308A1Publication Date: 2020-06-11
- Inventor: Chia-Yu Chang , Chih-Chien Ho , Steven Su
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; G06F30/394
Abstract:
A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.
Public/Granted literature
- US11342247B2 Leadframe with vertically spaced die attach pads Public/Granted day:2022-05-24
Information query
IPC分类:
