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    Electronic device with exposed tie bar
    5.
    发明授权
    Electronic device with exposed tie bar 有权

    公开(公告)号：US11817374B2

    公开(公告)日：2023-11-14

    申请号：US17229955

    申请日：2021-04-14

    Applicant: Texas Instruments Incorporated

    Inventor： Chih-Chien Ho ,  Bo-Hsun Pan ,  Yuh-Harng Chien

    IPC: H01L23/495 ,  H01L21/50 ,  H01L21/56 ,  H01L23/00

    CPC classification number: H01L23/4951 ,  H01L21/50 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/49 ,  H01L24/85 ,  H01L2924/181

    Abstract: A packaged electronic device has a package structure, first leads, second leads and a tie bar. The package structure has a first side, a second side, a third side, a fourth side, a fifth side and a sixth side, the second side spaced from the first side along a first direction, the fourth side spaced from the third side along an orthogonal second direction, and the sixth side spaced from the fifth side along an orthogonal third direction. The first leads extend outward in a first plane of the second and third directions from respective portions of the third side, the second leads extend outward in the first plane from respective portions of the fourth side, and the tie bar is exposed along the fifth side in a second plane of the second and third directions, the second plane between the first plane and the first side.

    INTERCONNECT SINGULATION
    7.
    发明申请
    INTERCONNECT SINGULATION 有权

    公开(公告)号：US20230121743A1

    公开(公告)日：2023-04-20

    申请号：US17504148

    申请日：2021-10-18

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Chih-Chien Ho

    IPC: H01L21/48 ,  H01L21/66

    Abstract: A method for aligning interconnects that includes trimming and forming a frame of strips of interconnects. The frame of strips of interconnects includes interdigitated pins. The method also includes removing siderails from the frame of strips of interconnects to provide an array of strips of interconnects. The method includes aligning a first set of strips of interconnects in the array of strips of interconnects such that pins of the first set of strips of interconnects are aligned with pins of a second set of strips of interconnects in the array of strips of interconnects. A strip of interconnects of the first set of strips of interconnects are adjacent to a strip of interconnects of the second set of strips of interconnects to provide an aligned array of strips of interconnects. The method further includes singulating the aligned array of strips of interconnects.

    ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD
    8.
    发明申请
    ELECTRONIC DEVICE WITH THREE DIMENSIONAL THERMAL PAD 有权

    公开(公告)号：US20210043548A1

    公开(公告)日：2021-02-11

    申请号：US16537535

    申请日：2019-08-10

    Applicant: Texas Instruments Incorporated

    Inventor： Stanley Chou ,  Yuh-Harng Chien ,  Steven Alfred Kummerl ,  Bo-Hsun Pan ,  Pi-Chiang Huang ,  Frank Yu ,  Chih-Chien Ho

    IPC: H01L23/495 ,  H01L23/492 ,  H01L23/00

    Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.

    ELECTRONIC DEVICE WITH EXPOSED TIE BAR
    9.
    发明申请
    ELECTRONIC DEVICE WITH EXPOSED TIE BAR 有权

    公开(公告)号：US20220336331A1

    公开(公告)日：2022-10-20

    申请号：US17229955

    申请日：2021-04-14

    Applicant: Texas Instruments Incorporated

    Inventor： Chih-Chien Ho ,  Bo-Hsun Pan ,  Yuh-Harng Chien

    IPC: H01L23/495 ,  H01L21/50

    Abstract: A packaged electronic device has a package structure, first leads, second leads and a tie bar. The package structure has a first side, a second side, a third side, a fourth side, a fifth side and a sixth side, the second side spaced from the first side along a first direction, the fourth side spaced from the third side along an orthogonal second direction, and the sixth side spaced from the fifth side along an orthogonal third direction. The first leads extend outward in a first plane of the second and third directions from respective portions of the third side, the second leads extend outward in the first plane from respective portions of the fourth side, and the tie bar is exposed along the fifth side in a second plane of the second and third directions, the second plane between the first plane and the first side.

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