Invention Application
- Patent Title: THERMALLY EXPANDABLE SHEET, MANUFACTURING METHOD OF THERMALLY EXPANDABLE SHEET, AND SHAPED OBJECT
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Application No.: US16713156Application Date: 2019-12-13
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Publication No.: US20200206990A1Publication Date: 2020-07-02
- Inventor: Hiroshi MOROKUMA , Satoshi MITSUI , Yoshimune MOTOYANAGI , Yuji HORIUCHI
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7223b75b
- Main IPC: B29C44/34
- IPC: B29C44/34 ; B29C44/02 ; B29C35/08 ; B41M7/00

Abstract:
An thermally expandable sheet includes a base and a thermal expansion layer arranged on one surface of the base and configured to be used in manufacture of a shaped object by swelling of at least a portion of the thermal expansion layer. The thermal expansion layer includes a first thermally expandable material having a first expansion initiation temperature and a first maximum expansion temperature, and a second thermally expandable material having a second expansion initiation temperature and a second maximum expansion temperature. The first expansion initiation temperature and the second expansion initiation temperature are high in comparison to a temperature of an environment in which the shaped object is to be placed. The second maximum expansion temperature is high in comparison to the first maximum expansion temperature.
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