- 专利标题: NCF FOR PRESSURE MOUNTING, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE INCLUDING SAME
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申请号: US16623447申请日: 2018-06-12
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公开(公告)号: US20200207977A1公开(公告)日: 2020-07-02
- 发明人: Kenichi Tosaka , Yoshihide Fukuhara , Hiromi Saito , Toyokazu Hotchi , Masaaki Hoshiyama
- 申请人: NAMICS CORPORATION
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@39f0ea6a
- 国际申请: PCT/JP2018/022390 WO 20180612
- 主分类号: C08L63/00
- IPC分类号: C08L63/00 ; C08G59/50 ; H01L23/29
摘要:
There is provided a pre-applied semiconductor sealing film for curing under pressure atmosphere as a non conductive film (NCF) suitable for pressure mounting. This NCF includes (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and contains at least one of structures represented by formulae 1 and 2 below, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000. The epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340. The component (B) is included in an amount of 6 to 27 parts by mass relative to 100 parts by mass of the component (A). The component (C) is included in an amount of 20 to 65 parts by mass relative to 100 parts by mass in total of the components. A content ratio ((A):(D)) between the component (A) and the component (D) is 99:1 to 65:35. This NCF further has a melt viscosity at 120° C. of 100 Pa·s or less, and has a melt viscosity at 120° C., after heated at 260° C. or more for 5 to 90 seconds, of 200 Pa·s or less.