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8 条记录 (耗时 0.018 秒)

    Resin composition-filled syringe, and production method and preservation method for same
    1.
    发明授权
    Resin composition-filled syringe, and production method and preservation method for same 有权

    公开(公告)号：US11623813B2

    公开(公告)日：2023-04-11

    申请号：US17435198

    申请日：2020-02-06

    申请人： NAMICS CORPORATION

    发明人： Hiroki Myodo ,  Masaaki Hoshiyama

    IPC分类号： B65D83/00

    摘要： There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

    Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production method
    3.
    发明授权
    Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production method 有权
    预测热固性树脂粘度行为的方法，模拟软件，制备热固性树脂的方法以及生产方法中生产的底部填料

    公开(公告)号：US09417228B2

    公开(公告)日：2016-08-16

    申请号：US14256201

    申请日：2014-04-18

    申请人： Namics Corporation

    发明人： Toshiaki Enomoto ,  Arata Hayashigaki ,  Masaaki Hoshiyama ,  Toyokazu Hotchi ,  Toshiyuki Sato

    IPC分类号： G01N33/44 ,  G01N11/00 ,  C09J9/00

    CPC分类号： G01N33/442 ,  G01N11/00 ,  G01N2011/0093 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00

    摘要： A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained. The method includes: measuring a reaction rate and measuring viscosity behavior to measure a calorimetry peak and viscosity behavior of the thermosetting resin with three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each rate of temperature increase obtained by the measuring a reaction rate to a Kamal model formula to obtain fitting curves; fitting viscosity behavior to fit parameters in the Kamal model formula and the measurement data for each rate of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula to obtain fitting curves; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each rate of temperature increase obtained by the fitting viscosity behavior.

    摘要翻译： 提供预测热固性树脂的粘度行为的方法，其能够预测热固性树脂的粘度行为，并且在获得良好的焊接连接的同时抑制底部填充物中的空隙产生。 该方法包括：测量反应速率和测量粘度行为，以分别测量三种或更多种温度升高的热固性树脂的量热峰和粘度行为; 通过测量反应速率达到Kamal模型公式获得的每个温度升高速率来拟合测量数据以获得拟合曲线; 拟合粘度行为，以拟合Kamal模型公式中的参数和通过测量粘度行为获得的每个温度升高速率的测量数据，得到卡斯特罗 - 马科斯科模型公式，以获得拟合曲线; 并计算虚拟粘度行为以通过基于通过拟合粘度行为获得的每个升温速率的每个拟合曲线的模拟来计算任意温度升高的热固性树脂的虚拟粘度行为。

    METHOD OF PREDICTING VISCOSITY BEHAVIOR OF THERMOSETTING RESIN, SIMULATION SOFTWARE, METHOD OF PRODUCING THERMOSETTING RESIN, AND UNDERFILL PRODUCED IN THE PRODUCTION METHOD
    4.
    发明申请
    METHOD OF PREDICTING VISCOSITY BEHAVIOR OF THERMOSETTING RESIN, SIMULATION SOFTWARE, METHOD OF PRODUCING THERMOSETTING RESIN, AND UNDERFILL PRODUCED IN THE PRODUCTION METHOD 有权
    热固性树脂的粘度行为的预测方法，模拟软件，生产热固性树脂的方法和生产方法中的生产方法

    公开(公告)号：US20140316102A1

    公开(公告)日：2014-10-23

    申请号：US14256201

    申请日：2014-04-18

    申请人： Namics Corporation

    发明人： Toshiaki Enomoto ,  Arata Hayashigaki ,  Masaaki Hoshiyama ,  Toyokazu Hotchi ,  Toshiyuki Sato

    IPC分类号： G01N33/44 ,  C09J9/00

    CPC分类号： G01N33/442 ,  G01N11/00 ,  G01N2011/0093 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00

    摘要： A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained. The method includes: measuring a reaction rate and measuring viscosity behavior to measure a calorimetry peak and viscosity behavior of the thermosetting resin with three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each rate of temperature increase obtained by the measuring a reaction rate to a Kamal model formula to obtain fitting curves; fitting viscosity behavior to fit parameters in the Kamal model formula and the measurement data for each rate of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula to obtain fitting curves; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each rate of temperature increase obtained by the fitting viscosity behavior.

    摘要翻译： 提供预测热固性树脂的粘度行为的方法，其能够预测热固性树脂的粘度行为，并且在获得良好的焊接连接的同时抑制底部填充物中的空隙产生。 该方法包括：测量反应速率和测量粘度行为，以分别测量三种或更多种温度升高的热固性树脂的量热峰和粘度行为; 通过测量反应速率达到Kamal模型公式获得的每个温度升高速率来拟合测量数据以获得拟合曲线; 拟合粘度行为，以拟合Kamal模型公式中的参数和通过测量粘度行为获得的每个温度升高速率的测量数据，得到卡斯特罗 - 马科斯科模型公式，以获得拟合曲线; 并计算虚拟粘度行为以通过基于通过拟合粘度行为获得的每个升温速率的每个拟合曲线的模拟来计算任意温度升高的热固性树脂的虚拟粘度行为。

    NCF for pressure mounting, cured product thereof, and semiconductor device including same
    5.
    发明授权
    NCF for pressure mounting, cured product thereof, and semiconductor device including same 有权

    公开(公告)号：US11485848B2

    公开(公告)日：2022-11-01

    申请号：US16623447

    申请日：2018-06-12

    申请人： NAMICS CORPORATION

    发明人： Kenichi Tosaka ,  Yoshihide Fukuhara ,  Hiromi Saito ,  Toyokazu Hotchi ,  Masaaki Hoshiyama

    IPC分类号： C08L63/00 ,  C08G59/50 ,  H01L23/29

    摘要： There is provided a pre-applied semiconductor sealing film for curing under pressure atmosphere as a non conductive film (NCF) suitable for pressure mounting. This NCF includes (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and contains at least one of structures represented by formulae 1 and 2 below, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000. The epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340. The component (B) is included in an amount of 6 to 27 parts by mass relative to 100 parts by mass of the component (A). The component (C) is included in an amount of 20 to 65 parts by mass relative to 100 parts by mass in total of the components. A content ratio ((A):(D)) between the component (A) and the component (D) is 99:1 to 65:35. This NCF further has a melt viscosity at 120° C. of 100 Pa·s or less, and has a melt viscosity at 120° C., after heated at 260° C. or more for 5 to 90 seconds, of 200 Pa·s or less.

    Semiconductor device
    6.
    发明授权
    Semiconductor device 有权

    公开(公告)号：US11315846B2

    公开(公告)日：2022-04-26

    申请号：US16626467

    申请日：2018-08-09

    申请人： NAMICS CORPORATION

    发明人： Hiroki Myodo ,  Toyokazu Hotchi ,  Masaaki Hoshiyama

    IPC分类号： H01L23/495 ,  H01L23/29 ,  H01L23/24 ,  H01L23/31 ,  H01L23/433 ,  H01L23/00

    摘要： An object of the present invention is to provide a semiconductor device in which peeling between a mold resin and a substrate is suppressed. A semiconductor device 1 includes a semiconductor chip 20 and a substrate 10 that are molded with a mold resin layer 40. The semiconductor device 1 includes a resin layer 50 having a thickness of 200 nm or less different from the mold resin layer 40 between the cured mold resin layer 40 and the substrate 10. The resin layer 50 present between the mold resin layer 40 and the substrate 10 is preferably present on a periphery of 30% or more of the chip when an entire peripheral length of the chip is 100%.

    NCF FOR PRESSURE MOUNTING, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE INCLUDING SAME
    7.
    发明申请
    NCF FOR PRESSURE MOUNTING, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE INCLUDING SAME 审中-公开

    公开(公告)号：US20200207977A1

    公开(公告)日：2020-07-02

    申请号：US16623447

    申请日：2018-06-12

    申请人： NAMICS CORPORATION

    发明人： Kenichi Tosaka ,  Yoshihide Fukuhara ,  Hiromi Saito ,  Toyokazu Hotchi ,  Masaaki Hoshiyama

    IPC分类号： C08L63/00 ,  C08G59/50 ,  H01L23/29

    摘要： There is provided a pre-applied semiconductor sealing film for curing under pressure atmosphere as a non conductive film (NCF) suitable for pressure mounting. This NCF includes (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and contains at least one of structures represented by formulae 1 and 2 below, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000. The epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340. The component (B) is included in an amount of 6 to 27 parts by mass relative to 100 parts by mass of the component (A). The component (C) is included in an amount of 20 to 65 parts by mass relative to 100 parts by mass in total of the components. A content ratio ((A):(D)) between the component (A) and the component (D) is 99:1 to 65:35. This NCF further has a melt viscosity at 120° C. of 100 Pa·s or less, and has a melt viscosity at 120° C., after heated at 260° C. or more for 5 to 90 seconds, of 200 Pa·s or less.