- 专利标题： OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP
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申请号： US16635575申请日： 2018-07-20
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公开(公告)号： US20200220032A1公开(公告)日： 2020-07-09
- 发明人: Fabian Kopp , Attila Molnar
- 申请人： Osram OLED GmbH
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7cc81c1a
- 国际申请： PCT/EP2018/069724 WO 20180720
- 主分类号： H01L31/0224
- IPC分类号： H01L31/0224 ; H01L33/38 ; H01L31/0232 ; H01L33/46 ; H01L31/18
摘要：
An optoelectronic semiconductor chip may include a semiconductor layer sequence provided for generating and/or receiving radiation. The chip may further include a first trench structure and a second trench structure formed in the semiconductor layer sequence. A first contact finger structure may electrically conductively connect the second trench structure to a first semiconductor layer of the semiconductor layer sequence. The first contact finger structure may adjoin a first side surface and/or a second side surface of the second trench structure at least in places. A second contact finger structure may electrically conductively connect to a second semiconductor layer of the semiconductor layer sequence where the second contact finger may be arranged in the first trench structure.