Invention Application
- Patent Title: PROCESSING APPARATUS
-
Application No.: US16736241Application Date: 2020-01-07
-
Publication No.: US20200227287A1Publication Date: 2020-07-16
- Inventor: Masato KADOBE
- Applicant: TOKYO ELECTRON LIMITED
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@529eb0b1
- Main IPC: H01L21/67
- IPC: H01L21/67 ; F24F3/16

Abstract:
There is provided a processing apparatus including: a processing part including a plurality of process modules connected to each other in a first room, and a loader module provided in the first room and accommodating a carrier which receives a substrate processed by each of the plurality of process modules; and a plurality of pump units corresponding to the plurality of process modules, respectively, and arranged in a second room adjacent to the first room, wherein an installation area of the plurality of pump units is equal to or smaller than that of the processing part.
Public/Granted literature
- US11581198B2 Processing apparatus Public/Granted day:2023-02-14
Information query
IPC分类: