Invention Application

  • Patent Title: PROCESSING APPARATUS
  • Application No.: US16736241
    Application Date: 2020-01-07
  • Publication No.: US20200227287A1
    Publication Date: 2020-07-16
  • Inventor: Masato KADOBE
  • Applicant: TOKYO ELECTRON LIMITED
  • Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@529eb0b1
  • Main IPC: H01L21/67
  • IPC: H01L21/67 F24F3/16
PROCESSING APPARATUS
Abstract:
There is provided a processing apparatus including: a processing part including a plurality of process modules connected to each other in a first room, and a loader module provided in the first room and accommodating a carrier which receives a substrate processed by each of the plurality of process modules; and a plurality of pump units corresponding to the plurality of process modules, respectively, and arranged in a second room adjacent to the first room, wherein an installation area of the plurality of pump units is equal to or smaller than that of the processing part.
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