Invention Application
- Patent Title: Diameter Multifold Message
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Application No.: US16827492Application Date: 2020-03-23
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Publication No.: US20200304996A1Publication Date: 2020-09-24
- Inventor: Manisha Sameer Gambhir Parekh , Shivani Mehrotra
- Applicant: Parallel Wireless, Inc.
- Main IPC: H04W12/06
- IPC: H04W12/06

Abstract:
Systems, methods and computer software are disclosed for providing a Diameter multifold message. In one embodiment a method is disclosed, comprising: providing a multifold-command Attribute Value Pair (AVP), the multifold-command AVP including an AVP code, a set of VMP flags, an AVP length and a vendor ID; including the AVP in a Capabilities Exchange Request (CER) command for a Diameter stack supporting multiplexing of commands in one message; and using the AVP to combine messages from multiple applications running on a single Diameter node and multiple commands from a single application.
Information query