Diameter Multifold Message
    1.
    发明申请

    公开(公告)号:US20200304996A1

    公开(公告)日:2020-09-24

    申请号:US16827492

    申请日:2020-03-23

    Abstract: Systems, methods and computer software are disclosed for providing a Diameter multifold message. In one embodiment a method is disclosed, comprising: providing a multifold-command Attribute Value Pair (AVP), the multifold-command AVP including an AVP code, a set of VMP flags, an AVP length and a vendor ID; including the AVP in a Capabilities Exchange Request (CER) command for a Diameter stack supporting multiplexing of commands in one message; and using the AVP to combine messages from multiple applications running on a single Diameter node and multiple commands from a single application.

Patent Agency Ranking