Invention Application
- Patent Title: CONDITIONER, CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE APPARATUS
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Application No.: US16662439Application Date: 2019-10-24
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Publication No.: US20200346317A1Publication Date: 2020-11-05
- Inventor: Seungchul HAN , Yonghee LEE , Taemin EARMME , Byoungho KWON , Kuntack LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@52cc19e9
- Main IPC: B24B37/005
- IPC: B24B37/005 ; B24B37/20
Abstract:
A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.
Public/Granted literature
Information query
