A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of an Fe—Si—Cr alloy, a thermosetting resin, and a solvent into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.