Invention Application
- Patent Title: THERMAL PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
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Application No.: US16911293Application Date: 2020-06-24
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Publication No.: US20210001641A1Publication Date: 2021-01-07
- Inventor: Goro NAKATANI , Akira FUJITA , Kazuya NAKAKUBO , Yasuhiro FUWA
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto-shi
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto-shi
- Priority: JP2019-124488 20190703
- Main IPC: B41J2/335
- IPC: B41J2/335 ; B41J2/34
Abstract:
A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.
Public/Granted literature
- US11097554B2 Thermal printhead and method of manufacturing the same Public/Granted day:2021-08-24
Information query
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