Some embodiments of the disclosure provide an LED device, an LED lamp and a method for machining a conductive wire of an LED device. The Light-Emitting Diode (LED) device includes at least one LED chip, a bracket and at least one conductive wire. Each of the at least one conductive wire is of a three-dimensional structure and includes a vertical section, first stress cushioning section inclined obliquely upwards, second stress cushioning section inclined obliquely downwards and third stress cushioning section inclined obliquely downwards that are sequentially arranged. A first transition bending section, a second transition bending section and a third transition bending section are sequentially formed between the vertical section, the first stress cushioning section, the second stress cushioning section and the third stress cushioning section, the first transition bending section, the second transition bending section and the third transition bending section are sequentially arranged along a length direction of the conductive wire, and bending directions of the second transition bending section and the third transition bending section are opposite. One end of the conductive wire is configured to connect the LED chip, and the other end is configured to connect the bracket or another LED chip. The present invention also discloses an LED lamp and a method for machining a conductive wire of an LED device. The reliability of the LED device of the present invention is improved to a certain extent.