Invention Application
- Patent Title: ASSISTING COMMUNICATIONS OF SMALL DATA PAYLOADS WITH RELAY NODES
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Application No.: US16904210Application Date: 2020-06-17
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Publication No.: US20210014729A1Publication Date: 2021-01-14
- Inventor: Vasanthan Raghavan , Tianyang Bai , Jung Ho Ryu , Hua Wang , Junyi Li
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04W28/06
- IPC: H04W28/06

Abstract:
Certain aspects of the present disclosure relate to assisting communications with low data payloads with relay nodes. An example method generally includes forming a first cluster with a first wireless node and one or more second wireless nodes, wherein each of the second wireless nodes has a low data rate demand relative to a system bandwidth. The method also includes determining to serve as a relay node for the first cluster, generating a first set of packets for uplink transmission to a base station, receiving a second set of packets from the one or more second wireless nodes, combining the first set of packets and the second set of packets into an uplink payload based on the determination, and transmitting, to the base station, the uplink payload based on the determination.
Public/Granted literature
- US11540171B2 Assisting communications of small data payloads with relay nodes Public/Granted day:2022-12-27
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