Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US17065235Application Date: 2020-10-07
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Publication No.: US20210020763A1Publication Date: 2021-01-21
- Inventor: Wei-Sheng YUN , Shao-Ming YU , Tung-Ying LEE , Chih-Chieh YEH
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/08

Abstract:
A device includes a semiconductor fin, a first epitaxy structure and a gate stack. The semiconductor fin protrudes from a substrate. The first epitaxy feature laterally surrounds a first portion of the semiconductor fin. The gate stack laterally surrounds a second portion of the semiconductor fin above the first portion of the semiconductor fin, wherein the second portion of the semiconductor fin has a lower surface roughness than the first epitaxy feature.
Public/Granted literature
- US11621344B2 Semiconductor device Public/Granted day:2023-04-04
Information query
IPC分类: