Invention Application
- Patent Title: METHOD, APPARATUS AND SYSTEM FOR WIDE METAL LINE FOR SADP ROUTING
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Application No.: US17070708Application Date: 2020-10-14
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Publication No.: US20210027005A1Publication Date: 2021-01-28
- Inventor: Lei Yuan , Juhan Kim
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Main IPC: G06F30/392
- IPC: G06F30/392 ; H01L23/522 ; H01L23/528 ; G06F30/394

Abstract:
At least one method, apparatus and system disclosed involves a circuit layout for an integrated circuit device comprising a plurality of wider-than-default metal formations for a functional cell. A design for an integrated circuit device is received. The design comprises at least one functional cell. A first pair of wide metal formations are provided. The first pair of wide metal formations comprise a first metal formation and a second metal placed about a first cell boundary of the functional cell for providing additional space for routing, for high-drive routing, and/or for power routing.
Public/Granted literature
- US11205033B2 Method, apparatus and system for wide metal line for SADP routing Public/Granted day:2021-12-21
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