Invention Application
- Patent Title: METHOD AND APPARATUS FOR TEMPERATURE-GRADIENT AWARE DATA-PLACEMENT FOR 3D STACKED DRAMS
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Application No.: US16939814Application Date: 2020-07-27
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Publication No.: US20210034256A1Publication Date: 2021-02-04
- Inventor: Jagadish B. KOTRA , Karthik RAO , Joseph L. GREATHOUSE
- Applicant: ADVANCED MICRO DEVICES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F3/06
- IPC: G06F3/06
Abstract:
A system including a stack of two or more layers of volatile memory, such as layers of a 3D stacked DRAM memory, places data in the stack based on a temperature or a refresh rate. When a threshold is exceeded, data are moved from a first region to a second region in the stack, the second region having one or both of a second temperature lower than a first temperature of the first region or a second refresh rate lower than a first refresh rate of the first region.
Public/Granted literature
- US11556250B2 Method and apparatus for temperature-gradient aware data-placement for 3D stacked DRAMs Public/Granted day:2023-01-17
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