Invention Application
- Patent Title: INTEGRATED FILTER STACK FOR A RADIO FREQUENCY (RF) FRONT-END MODULE (FEM)
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Application No.: US16526672Application Date: 2019-07-30
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Publication No.: US20210036685A1Publication Date: 2021-02-04
- Inventor: Telesphor Kamgaing , Feras Eid , Georgios Dogiamis , Aleksandar Aleksov , Johanna M. Swan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H03H9/205
- IPC: H03H9/205 ; H03F3/24 ; H03H9/25 ; H01L41/053 ; H03H9/64 ; H03H9/54 ; H01L25/10 ; H01L23/10 ; H01L23/552
Abstract:
Embodiments may relate to a radio frequency (RF) front-end module (FEM) that includes a first acoustic wave resonator (AWR) die coupled with a package substrate. The RF FEM may also include a second AWR die coupled with the first AWR die. The first AWR die may be between the package substrate and the second AWR die. Other embodiments may be described or claimed.
Information query
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