- 专利标题: Electronic module
-
申请号: US17005527申请日: 2020-08-28
-
公开(公告)号: US20210037654A1公开(公告)日: 2021-02-04
- 发明人: Risto Tuominen , Petteri Palm
- 申请人: IMBERATEK, LLC
- 申请人地址: US VA Herndon
- 专利权人: IMBERATEK, LLC
- 当前专利权人: IMBERATEK, LLC
- 当前专利权人地址: US VA Herndon
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; H01L23/538 ; H01L23/552 ; H01L23/00 ; H01L25/10 ; H01L25/00
摘要:
The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.
公开/授权文献
- US11071207B2 Electronic module 公开/授权日:2021-07-20
信息查询