公开(公告)号：US11792941B2

公开(公告)日：2023-10-17

申请号：US17460458

申请日：2021-08-30

申请人： ImberaTek LLC

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K3/06 ,  H01L21/48 ,  H01L23/13 ,  H01L23/538 ,  H01L23/544 ,  H01L23/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H01L21/56 ,  H05K3/20 ,  H05K3/40

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/321 ,  H01L21/568 ,  H01L24/81 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/293 ,  H01L2224/2929 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/1517 ,  H01L2924/15153 ,  H05K3/205 ,  H05K3/32 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/50 ,  Y10T29/4913 ,  H01L2924/00011 ,  H01L2224/29075 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/00014 ,  H01L2224/293 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/0401 ,  H01L2924/00011 ,  H01L2224/0401

摘要： The present publication discloses a circuit-board structure, including a conductor layer on an insulating material layer, and a conductor pattern on top of the conductor foil. A component is attached to the conductor foil and the conductor pattern, the component embedded at least in part in adhesive which attaches the component to the insulating material layer. A recess is formed in the conductor foil and the insulating material layer, and contact openings are in the insulating material layer at locations of contact areas of the component. Conductor material of the conductor foil is not present outside the conductor pattern, and the conductor foil is located between the conductor pattern and the insulating material layer.

公开(公告)号：US20210392752A1

公开(公告)日：2021-12-16

申请号：US17460458

申请日：2021-08-30

申请人： ImberaTek LLC

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K3/06 ,  H01L21/48 ,  H01L23/13 ,  H01L23/538 ,  H01L23/544 ,  H01L23/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H01L21/56

摘要： The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.

公开(公告)号：USRE49970E1

公开(公告)日：2024-05-14

申请号：US17213981

申请日：2021-03-26

申请人： IMBERATEK, LLC

发明人： Antti Kivikero ,  Pekka Kostensalo ,  Jaakko Hekki Tapie Moisala

IPC分类号： H05K1/18 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552

CPC分类号： H05K1/18 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/31 ,  H01L24/83 ,  H01L21/4821 ,  H01L23/5386 ,  H01L23/552 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2924/12042 ,  H01L2924/00

摘要： Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer (3), a component (1) having a surface with contact terminals (2) and first contact elements (6) that connect at least some of the contact terminals (2) to the wiring layer (3). The electronic module is provided with at least one conducting pattern (4) on the surface of the component (1) but spaced apart from the contact terminals (2). The electronic module further comprises a dielectric (5) and at least one second contact element (7) that connects the conducting pattern (4) to the wiring layer (3) through a portion of said dielectric (5). Methods of manufacturing such modules are also disclosed. An electronic module including a first wiring layer, a dielectric supporting the first wiring layer, wherein the first wiring layer is embedded in the dielectric, a component having a first surface and at least one contact terminal on the first surface, an additional passivation layer on the first surface of the component and in contact with the dielectric, a conducting pattern on the additional passivation layer on the first surface of the component and spaced apart from each of the at least one contact terminal, at least one first contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the at least one contact terminal, and at least one second contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the conducting pattern.

公开(公告)号：US20230225055A1

公开(公告)日：2023-07-13

申请号：US18184837

申请日：2023-03-16

申请人： IMBERATEK, LLC

发明人： Risto TUOMINEN ,  Petteri PALM

IPC分类号： H05K1/18 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H05K1/185 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L2224/05624 ,  H01L2224/08225 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/80203 ,  H01L2224/80205 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2924/15153 ,  H05K2201/042 ,  H05K2201/0367

摘要： The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

公开(公告)号：US11716816B2

公开(公告)日：2023-08-01

申请号：US17364593

申请日：2021-06-30

申请人： IMBERATEK, LLC

发明人： Antti Iihola ,  Timo Jokela

IPC分类号： H05K7/00 ,  H05K1/18 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/48 ,  H05K3/46

CPC分类号： H05K1/188 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49156 ,  H01L2924/07802 ,  H01L2924/00

摘要： This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

公开(公告)号：US11071207B2

公开(公告)日：2021-07-20

申请号：US17005527

申请日：2020-08-28

申请人： IMBERATEK, LLC

发明人： Risto Tuominen ,  Petteri Palm

IPC分类号： H05K1/18 ,  H05K3/46 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00 ,  H01L23/552 ,  H01L23/538 ,  H01L21/48 ,  H01L23/13 ,  H01L23/29 ,  H01L23/544 ,  H05K1/02 ,  H05K3/28 ,  H01L21/56

摘要： The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

公开(公告)号：USRE48539E1

公开(公告)日：2021-04-27

申请号：US15938967

申请日：2018-03-28

申请人： IMBERATEK, LLC

发明人： Antti Kivikero ,  Pekka Kostensalo ,  Jaakko Hekki Tapie Moisala

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L21/48 ,  H05K1/18

摘要： Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer (3), a component (1) having a surface with contact terminals (2) and first contact elements (6) that connect at least some of the contact terminals (2) to the wiring layer (3). The electronic module is provided with at least one conducting pattern (4) on the surface of the component (1) but spaced apart from the contact terminals (2). The electronic module further comprises a dielectric (5) and at least one second contact element (7) that connects the conducting pattern (4) to the wiring layer (3) through a portion of said dielectric (5). Methods of manufacturing such modules are also disclosed.

公开(公告)号：US20210037654A1

公开(公告)日：2021-02-04

申请号：US17005527

申请日：2020-08-28

申请人： IMBERATEK, LLC

发明人： Risto Tuominen ,  Petteri Palm

IPC分类号： H05K1/18 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00

摘要： The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

公开(公告)号：US20210329788A1

公开(公告)日：2021-10-21

申请号：US17364593

申请日：2021-06-30

申请人： IMBERATEK, LLC

发明人： Antti Iihola ,  Timo Jokela

IPC分类号： H05K1/18 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/48

摘要： This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

公开(公告)号：US20210321520A1

公开(公告)日：2021-10-14

申请号：US17357399

申请日：2021-06-24

申请人： IMBERATEK, LLC

发明人： Risto Tuominen ,  Petteri Palm

IPC分类号： H05K1/18 ,  H05K3/46 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00 ,  H01L23/552 ,  H01L23/538 ,  H01L21/48

摘要： The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.