- 专利标题： CIRCUIT BOARD INCLUDING CONDUCTIVE STRUCTURE FOR ELECTRICALLY CONNECTING WIRES, AND ELECTRONIC DEVICE INCLUDING SAME
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申请号： US16977617申请日： 2019-03-08
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公开(公告)号： US20210044681A1公开(公告)日： 2021-02-11
- 发明人: Junghoon PARK , Dongyup LEE , Hyunseok KIM , Yongseung YI , Hoyeong LIM , Seunggoo KANG , Dongil SON , Hyangbok LEE
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 优先权： KR10-2018-0027309 20180308
- 国际申请： PCT/KR2019/002751 WO 20190308
- 主分类号： H04M1/02
- IPC分类号： H04M1/02 ; H05K1/02 ; G06F1/16
摘要：
Disclosed are various embodiments relating to a circuit board included in an electronic device and, according to one embodiment, the circuit board can comprise: at least one wire included on the circuit board, at least one conductive structure arranged on the circuit board in order to reinforce the circuit board, and arranged in order to electrically connect the at least one wire; and at least one conductive member included on the circuit board, and electrically connecting the at least one wire with the at least one conductive structure, and additional other various embodiments are possible.