A semiconductor device package includes a substrate, a first antenna and a second antenna. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The first antenna pattern has a first port configured to generate a magnetic field. The second antenna pattern is disposed over the first surface of the substrate. The second antenna pattern has a second bandwidth different from the first bandwidth. A prolonged line of an edge of the first antenna pattern parallel to the magnetic field generated by the first port of the first antenna pattern is spaced apart from the second antenna pattern.