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公开(公告)号：US20240275061A1
公开(公告)日：2024-08-15
申请号：US18108498
申请日：2023-02-10
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
CPC classification number: H01Q13/10 , H01P3/08 , H05K1/0243 , H05K1/115 , H05K2201/10098
Abstract: The present disclosure provides an electronic device. The electronic device includes a radio frequency (RF) circuit region and an antenna region. The RF circuit region has a first circuit density. The antenna region includes a circuit structure. The circuit structure defines a waveguide. The circuit structure has a second circuit density less than the first circuit density.
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公开(公告)号：US20250149457A1
公开(公告)日：2025-05-08
申请号：US18500933
申请日：2023-11-02
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Cheng-Yu HO , Hong-Sheng HUANG , Sheng-Chi HSIEH , Shao-En HSU , Huei-Shyong CHO
IPC: H01L23/538 , H01L23/00 , H01L25/065 , H01P3/00 , H01Q1/22
Abstract: The present disclosure relates to an electronic device that includes a first electronic component, a second electronic component, an interconnection structure below the first electronic component and the second electronic component and electrically connecting the first electronic component to the second electronic component, and a first waveguide below the first electronic component and the second electronic component and configured to transmit electromagnetic waves.
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公开(公告)号：US20210050649A1
公开(公告)日：2021-02-18
申请号：US16538592
申请日：2019-08-12
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
Abstract: A semiconductor device package includes a substrate, a first antenna and a second antenna. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The first antenna pattern has a first port configured to generate a magnetic field. The second antenna pattern is disposed over the first surface of the substrate. The second antenna pattern has a second bandwidth different from the first bandwidth. A prolonged line of an edge of the first antenna pattern parallel to the magnetic field generated by the first port of the first antenna pattern is spaced apart from the second antenna pattern.
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公开(公告)号：US20250167440A1
公开(公告)日：2025-05-22
申请号：US19033476
申请日：2025-01-21
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
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公开(公告)号：US20240347909A1
公开(公告)日：2024-10-17
申请号：US18134514
申请日：2023-04-13
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
CPC classification number: H01Q5/307 , H01Q15/0013 , H01Q21/065 , H01Q19/062
Abstract: The present disclosure provides an antenna package structure, including a first antenna and a first frequency selective surface structure. The first frequency selective surface structure is disposed above the first antenna, and includes a plurality of first patterns and a plurality of second patterns geometrically distinct from the plurality of the first patterns. The plurality of first patterns and the plurality of second patterns are configured to enhance gain and directivity of the first antenna.
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Patent Agency Ranking
公开(公告)号：US20190164916A1
公开(公告)日：2019-05-30
申请号：US16262768
申请日：2019-01-30
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
IPC: H01L23/66 , H01Q19/28 , H01Q19/08 , H01Q13/02 , H01P3/12 , H01Q13/08 , H01Q1/22 , H01P3/08 , H01L23/31 , H01L23/498
Abstract: An antenna semiconductor package device includes: (1) a waveguide cavity having a radiation opening; and (2) a first directing element outside of the waveguide cavity and separated from the waveguide cavity by a first gap.
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公开(公告)号：US20240347921A1
公开(公告)日：2024-10-17
申请号：US18134511
申请日：2023-04-13
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
CPC classification number: H01Q15/0013 , H01Q1/2283 , H01Q1/38
Abstract: The present disclosure provides an antenna package structure, which includes antenna and a transmitting structure. The transmitting structure includes a first dielectric material and a second dielectric material of different dielectric constants, and a frequency selective surface unit. The first dielectric layer and the second dielectric layer are configured to focus the electromagnetic wave radiated between the antenna and the frequency selective surface unit.
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公开(公告)号：US20240275060A1
公开(公告)日：2024-08-15
申请号：US18108489
申请日：2023-02-10
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
IPC: H01Q13/10
Abstract: The present disclosure provides an electronic device. The electronic device includes a signal transmission structure and a circuit. The signal transmission structure defines a waveguide. The signal transmission structure defines a plurality of first apertures. The circuit is configured to adjust a geometric profile of at least one of the plurality of first apertures to control a frequency of an electromagnetic wave radiated from the first apertures.
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公开(公告)号：US20210280968A1
公开(公告)日：2021-09-09
申请号：US17327644
申请日：2021-05-21
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
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公开(公告)号：US20250087887A1
公开(公告)日：2025-03-13
申请号：US18244208
申请日：2023-09-08
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
Abstract: An antenna module is provided. The antenna module includes a conductive structure, a first dielectric layer, and a second dielectric layer. The conductive structure defines a first space and a second space over the first space. The first dielectric layer is at least partially within the first space and has a first dielectric constant. The second dielectric layer is at least partially within the second space and has a second dielectric constant different from the first dielectric constant.
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