A process for producing a solder product and a copper product from a first lead-tin based metal composition having at least 40% wt of copper and at least 5.0% wt together of tin and lead. The process includes the steps of partially oxidizing a first liquid bath having the first lead-tin based metal composition, thereby forming a first dilute copper metal composition and a first solder refining slag, followed by separating the slag from the metal composition, and partially oxidizing a second liquid bath having the first dilute copper metal composition, thereby forming a first high-copper metal composition and a third solder refining slag, followed by separating the third solder refining slag from the first high-copper metal composition, whereby the solder product is derived from the first solder refining slag.