- 专利标题: CHIP WIRING LAYER TEMPERATURE SENSING CIRCUIT, TEMPERATURE SENSING METHOD AND CHIP THEREOF
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申请号: US16927438申请日: 2020-07-13
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公开(公告)号: US20210072095A1公开(公告)日: 2021-03-11
- 发明人: Bo WANG , Hongfeng ZHU , Jian LIU , Jun YI , Qibin ZHU
- 申请人: Zhejiang Johar Technology Co., Ltd.
- 申请人地址: CN Hangzhou
- 专利权人: Zhejiang Johar Technology Co., Ltd.
- 当前专利权人: Zhejiang Johar Technology Co., Ltd.
- 当前专利权人地址: CN Hangzhou
- 优先权: CN201910848182.0 20190909
- 主分类号: G01K7/02
- IPC分类号: G01K7/02 ; G01K7/14
摘要:
This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.
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