公开(公告)号：US20210072095A1

公开(公告)日：2021-03-11

申请号：US16927438

申请日：2020-07-13

申请人： Zhejiang Johar Technology Co., Ltd.

发明人： Bo WANG ,  Hongfeng ZHU ,  Jian LIU ,  Jun YI ,  Qibin ZHU

IPC分类号： G01K7/02 ,  G01K7/14

摘要： This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.