An embedded component package structure including a dielectric structure, a semiconductor chip and a patterned conductive layer is provided. The semiconductor chip is embedded in the dielectric structure, and the dielectric structure encapsulates the semiconductor chip and has a first thickness. The semiconductor chip having a second thickness, and the first thickness is greater than the second thickness, and a ratio of the first thickness to the second thickness is between 1.1 and 28.4. The patterned conductive layer covers an upper surface of the dielectric structure and extending into a first opening of the dielectric structure. The first opening exposes an electrical pad of the semiconductor chip, and the patterned conductive layer is electrically connected to the electrical pad of the semiconductor chip.