- 专利标题: Multi-level Mounting System
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申请号: US17080464申请日: 2020-10-26
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公开(公告)号: US20210095895A1公开(公告)日: 2021-04-01
- 发明人: Chad Robinson
- 申请人: Unirac Inc.
- 申请人地址: US NM Albuquerque
- 专利权人: Unirac Inc.
- 当前专利权人: Unirac Inc.
- 当前专利权人地址: US NM Albuquerque
- 主分类号: F24S25/33
- IPC分类号: F24S25/33 ; H02S20/23 ; F24S25/13 ; F24S25/61 ; F24S25/632 ; F24S25/30 ; H02S30/00
摘要:
A tiered mounting system includes a base plate including a mounting guide rail having a plurality of mounting grooves that extend along opposing sides of the guide rail. The system also includes an object mount connector having a plurality of mounting ridges. The object mount connector is configured to: slidingly engage the mounting guide rail via insertion of one or more of the plurality of mounting ridges within a corresponding one or more of the plurality of mounting grooves, and lock in place along the mounting guide rail via a bolt placed through the object mount connector and secured tightly to an inner track of the mounting guide rail.
公开/授权文献
- US11365904B2 Multi-level mounting system 公开/授权日:2022-06-21
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