Invention Application
- Patent Title: FLEXIBLE THERMOELECTRIC DEVICE
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Application No.: US15733294Application Date: 2018-12-20
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Publication No.: US20210098678A1Publication Date: 2021-04-01
- Inventor: Ravi Palaniswamy , Antonny E. Flor , HongQian Bao , Jaime L. Angeles , Jae Yong Lee , Mahmut Aksit
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- International Application: PCT/IB2018/060477 WO 20181220
- Main IPC: H01L35/32
- IPC: H01L35/32 ; H01L35/30 ; A42B3/28 ; H01L35/24

Abstract:
Flexible thermoelectric devices including a flexible heat management layer on the hot side thereof, and methods of making and using the same, are provided. The flexible heat management layer includes a water harvesting material configured to absorb water or moisture and dissipate heat by evaporation of the absorbed water or moisture. In some cases, the water harvesting material includes a mixture of a superabsorbent polymer (SAP) material and a metal-organic framework (MOF) material.
Information query
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