Invention Application
- Patent Title: EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN IC CIRCUITS
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Application No.: US16592102Application Date: 2019-10-03
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Publication No.: US20210104474A1Publication Date: 2021-04-08
- Inventor: Michael Lee Dawson , Edward J. Pryor, III , Jeffrey L. Large , Mary Coles
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L23/66 ; H01L49/02 ; H01Q1/22
Abstract:
An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
Public/Granted literature
- US11233017B2 Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits Public/Granted day:2022-01-25
Information query
IPC分类:
