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公开(公告)号：US11233017B2
公开(公告)日：2022-01-25
申请号：US16592102
申请日：2019-10-03
Applicant: Texas Instruments Incorporated
Inventor： Michael Lee Dawson , Edward J. Pryor, III , Jeffrey L. Large , Mary Coles
Abstract: An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
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公开(公告)号：US11967569B2
公开(公告)日：2024-04-23
申请号：US17555107
申请日：2021-12-17
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Michael Lee Dawson , Edward J. Pryor, III , Jeffrey L. Large , Mary Coles
CPC classification number: H01L23/645 , H01L23/66 , H01L28/10 , H01Q1/2283
Abstract: A method includes attaching a first portion of a preformed metal micro-wire to a multilayer structure. The preformed metal micro-wire has a diameter of 10 microns or less. The method also includes attaching a second portion of the preformed metal micro-wire to the multilayer structure.
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公开(公告)号：US20240274550A1
公开(公告)日：2024-08-15
申请号：US18641571
申请日：2024-04-22
Applicant: Texas Instruments Incorporated
Inventor： Michael Lee Dawson , Edward J. Pryor, III , Jeffrey L. Large , Mary Coles
CPC classification number: H01L23/645 , H01L23/66 , H01L28/10 , H01Q1/2283
Abstract: A method of fabricating a circuit package includes mounting a micro-wire for transport, the micro-wire being formed of a metal and having a diameter of 10 microns or less and introducing the mounted micro-wire and the circuit package into a focused ion beam (FIB) apparatus that comprises a FIB microscope and a nanopositioner. The method further includes: bringing the micro-wire, the nanopositioner and the circuit package into a work area for the FIB apparatus; using the nanopositioner to bring the micro-wire and the circuit package together at a location for attachment; welding the micro-wire into position; and releasing the micro-wire.
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公开(公告)号：US20210104474A1
公开(公告)日：2021-04-08
申请号：US16592102
申请日：2019-10-03
Applicant: Texas Instruments Incorporated
Inventor： Michael Lee Dawson , Edward J. Pryor, III , Jeffrey L. Large , Mary Coles
Abstract: An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
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