Invention Application
- Patent Title: MICROMECHANICAL RESONATOR AND RESONATOR SYSTEM INCLUDING THE SAME
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Application No.: US16880231Application Date: 2020-05-21
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Publication No.: US20210126615A1Publication Date: 2021-04-29
- Inventor: Yongseop YOON , Sungchan KANG , Cheheung KIM , Choongho RHEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0134796 20191028
- Main IPC: H03H9/24
- IPC: H03H9/24 ; H03H9/02
Abstract:
A micromechanical resonator includes a support beam having a fixed end, and a free end configured to vibrate. The micromechanical resonator includes a lumped mass disposed on the free end. A height of the lumped mass is greater than a width of the lumped mass.
Public/Granted literature
- US11146240B2 Micromechanical resonator and resonator system including the same Public/Granted day:2021-10-12
Information query
