Invention Application
- Patent Title: ADDITIVE MANUFACTURING
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Application No.: US17051958Application Date: 2018-10-17
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Publication No.: US20210129430A1Publication Date: 2021-05-06
- Inventor: Alex Veis , Esteve Comas Cespedes , Marc Jansa Perez , Xavier Soler Pedemonte
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2018/056259 WO 20181017
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B29C64/277 ; B22F10/14 ; B33Y10/00 ; B33Y30/00

Abstract:
According to one example, there is provided a method of additive manufacturing that comprises obtaining data relating to a 3D object to be manufactured, forming a layer of build material on a build platform, applying a cooling agent in a pattern surrounding a portion of build material to be solidified, and applying energy only to the build material on which cooling agent is applied and to the surrounded portion of build material such that the surrounded portion of build material heats up sufficiently to coalesces, and such that build material on which cooling agent is applied is cooled by the cooling agent and is prevented from heating up sufficiently to coalesce.
Information query