Invention Application
- Patent Title: GAPS BETWEEN ELECTRICALLY CONDUCTIVE GROUND STRUCTURES
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Application No.: US16605040Application Date: 2017-12-08
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Publication No.: US20210129543A1Publication Date: 2021-05-06
- Inventor: Donald W. Schulte , Donald J. Milligan , Terry McMahon
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2017/065412 WO 20171208
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/14

Abstract:
In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.
Public/Granted literature
- US11214060B2 Gaps between electrically conductive ground structures Public/Granted day:2022-01-04
Information query
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