- 专利标题: HEAT PIPE MODULE AND HEAT DISSIPATING DEVICE USING THE SAME
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申请号: US17147334申请日: 2021-01-12
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公开(公告)号: US20210131743A1公开(公告)日: 2021-05-06
- 发明人: Chien-Hung SUN , Te-Hsuan CHIN
- 申请人: COOLER MASTER CO., LTD.
- 申请人地址: TW New Taipei City
- 专利权人: COOLER MASTER CO., LTD.
- 当前专利权人: COOLER MASTER CO., LTD.
- 当前专利权人地址: TW New Taipei City
- 优先权: CN201610114384.9 20160301
- 主分类号: F28D15/02
- IPC分类号: F28D15/02 ; F28D15/04 ; F28F1/02
摘要:
A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.
公开/授权文献
- US11493280B2 Heat pipe module and heat dissipating device using the same 公开/授权日:2022-11-08
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