Invention Application
- Patent Title: ELECTROCALORIC HEAT TRANSFER SYSTEM WITH EMBEDDED ELECTRONICS
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Application No.: US16623330Application Date: 2018-06-18
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Publication No.: US20210140686A1Publication Date: 2021-05-13
- Inventor: Joseph V. Mantese , Subramanyaravi Annapragada , Slade R. Culp , Sameh Dardona , Scott Alan Eastman , Wayde R. Schmidt , Parmesh Verma , Craig R. Walker , Wei Xie
- Applicant: Carrier Corporation
- Applicant Address: US FL Palm Beach Gardens
- Assignee: Carrier Corporation
- Current Assignee: Carrier Corporation
- Current Assignee Address: US FL Palm Beach Gardens
- International Application: PCT/US2018/038044 WO 20180618
- Main IPC: F25B21/00
- IPC: F25B21/00

Abstract:
An electrocaloric module includes a housing and an electrocaloric element in the housing. The electrocaloric element includes an electrocaloric film, a first electrode on a first surface of the electrocaloric film, and a second electrode on a second surface of the electrocaloric film. The electrocaloric module also includes a first thermal connection configured to connect to a first thermal flow path between the electrocaloric elements and a heat sink, a second thermal connection configured to connect to a second thermal flow path between the electrocaloric elements and a heat source, and a power connection connected to the first and second electrodes and configured to connect to a power source.
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