Invention Application
- Patent Title: PHOTOSENSITIVE RESIN COMPOSITION AND INSULATING LAYER PREPARED THEREFROM
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Application No.: US17084195Application Date: 2020-10-29
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Publication No.: US20210149305A1Publication Date: 2021-05-20
- Inventor: Su Min Lee , Jin Kwon , Ho-Suk Song
- Applicant: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
- Current Assignee: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Priority: KR10-2019-0148725 20191119
- Main IPC: G03F7/085
- IPC: G03F7/085 ; G03F7/033 ; G03F7/004
Abstract:
The present invention relates to a photosensitive resin composition and an insulation film prepared therefrom. Since the photosensitive resin composition comprises a blocked isocyanate-based compound, it can form a transparent insulation film while it maintains excellent film retention rate, hardness, and resolution.
Information query
IPC分类:
