A multilayer ceramic electronic component includes a ceramic body including first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a width direction, and fifth and sixth surfaces opposing each other in a longitudinal direction, and including a capacitance formation portion having a dielectric layer and first and second internal electrodes disposed to be stacked in the thickness direction with the dielectric layer interposed therebetween; first and second conductive layers disposed on the fifth and sixth surfaces of the ceramic body, respectively, and each including a first conductive metal; and first and second external electrodes each including a second conductive metal and covering the first and second conductive layers, respectively. The first and second conductive layers each have a network structure.