MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20210183576A1

    公开(公告)日:2021-06-17

    申请号:US16829640

    申请日:2020-03-25

    摘要: A multilayer ceramic electronic component includes a ceramic body including first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a width direction, and fifth and sixth surfaces opposing each other in a longitudinal direction, and including a capacitance formation portion having a dielectric layer and first and second internal electrodes disposed to be stacked in the thickness direction with the dielectric layer interposed therebetween; first and second conductive layers disposed on the fifth and sixth surfaces of the ceramic body, respectively, and each including a first conductive metal; and first and second external electrodes each including a second conductive metal and covering the first and second conductive layers, respectively. The first and second conductive layers each have a network structure.

    Multi-layer ceramic electronic component and manufacturing method thereof

    公开(公告)号:US11222751B2

    公开(公告)日:2022-01-11

    申请号:US16829640

    申请日:2020-03-25

    摘要: A multilayer ceramic electronic component includes a ceramic body including first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a width direction, and fifth and sixth surfaces opposing each other in a longitudinal direction, and including a capacitance formation portion having a dielectric layer and first and second internal electrodes disposed to be stacked in the thickness direction with the dielectric layer interposed therebetween; first and second conductive layers disposed on the fifth and sixth surfaces of the ceramic body, respectively, and each including a first conductive metal; and first and second external electrodes each including a second conductive metal and covering the first and second conductive layers, respectively. The first and second conductive layers each have a network structure.